應屆畢業(yè)生
學歷不限
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職位描述
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Summary:
1. Good knowledge of package design, knowledge of design for manufacturing.
2. Hands-on experience on PCB design in SMT or PCB factory.
3. Proficient Cadence software, CAD.
4. Bachelor’s degree with 8 years related experience.
- Package design for Manufacture.
- Package level and SMT level stencil design.
- Provide package total solution; include but not limited to Stack up discussion, layout, stencil design, timeline tracking and handle the package relevant qualification.
- Package design for Manufacture.
- Need work with assembly house, SMT site, material vendor, to develop and qualify the new materials and new package processes.
- Coordinate with the internal team to identify the module package related issues, give DFM report/ suggestions for new packages, address the root cause and find the solution.
- Sum up the experience of package design manufacture issue, SMT process and maintain the design rule.
- Review the packaging drawings and assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc.;
- Tracking new package project timeline and response to internal team.
- Perform other tasks assigned by superiors.
1. Good knowledge of package design, knowledge of design for manufacturing.
2. Hands-on experience on PCB design in SMT or PCB factory.
3. Proficient Cadence software, CAD.
4. Bachelor’s degree with 8 years related experience.
注：聯系我時，請說是在四川人才網上看到的。
工作地點
地址：成都郫都區(qū)郫都區(qū)成都高新綜合保稅區(qū)B區(qū)
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詳細位置，可以參考上方地址信息
求職提示：用人單位發(fā)布虛假招聘信息，或以任何名義向求職者收取財物（如體檢費、置裝費、押金、服裝費、培訓費、身份證、畢業(yè)證等），均涉嫌違法，請求職者務必提高警惕。
職位發(fā)布者
孫莉君/..HR
成都芯源系統(tǒng)有限公司
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電子技術·半導體·集成電路
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1000人以上
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公司性質未知
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高新區(qū)綜合保稅區(qū)科新路8號
